Our technologies for enabling SCIL include the stamp’s top layer component of X-PDMS, which facilitates fine detail, low pressure imprinting. Low pressure and zero damage characteristics are further enhanced through a choice of patented sol-gel resists, applied by capillary action. Lastly, for large volume production the complete process is carried out by our automated lithography tool, capable of manufacturing up to 60 wafers per hour.
Nanometre resolution patterns are possible due to the tri-layer stamp construction. Our X-PDMS (polydimethylsiloxane) top layer which carries the imprint structure is added to your chosen middle and bottom layers of soft PDMS and thin glass, respectively.
In this way, the stamp achieves conformal (full wafer contact) imprinting at low pressure. It is flexible enough to follow substrate unevenness while being rigid enough to create nano structures without any deformation. The X-PDMS is also soft enough for peel removing during sequential low force stamp release.
Our special inorganic sol-gel resist material is optically transparent, and UV and temperature stable. It can be used both as hard etch mask and as a functional layer.
- Good etch resistance: Directly patterned hard mask (saves two process steps)
- Good thermal stability: Directly patterned functional layers (transparency makes it suitable for optical applications from UV to IR)
Ensuring low pattern deformation, the capillary force driven imprint process only uses a low pressure imprint cycle. It also ensures that the imprinting direction is always vertical. After the resist has hardened the stamp is released in a smooth peeling action.