Equipment
SCIL Nanoimprint solutions offers NIL manufacturing solutions in a large variety. From manual R&D tools to fully automatic cassette-to-cassette systems and from 2” up to 300 mm wafers.
The manual R&D tools and automatic systems use the same imprint module which allows easy transition from manual to semi-manual and automatic processing.
Key features
- Tri-layer stamp construction allows conformal contact printing even on nonflat and bowed surfaces.
- Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles.
- Overlay alignment < 3 micron
- The excellent etch properties of the sol-gel resist result in high etch rates.
- The thermal stability, optical transparancy and (UV) stability of the sol-gel makes it suitable as functional layer.
- Use of thermal sol-gel increases stamp lifetime.
- Overall combining highest imprint quality and yield with high throughput and low total cost of ownership.
AutoSCIL
The fully automatic systems include all essential process steps in a closed coupled system: wafer handling, pre-aligning, spin-coating, SCIL imprinting, baking and cooling.
Specifications
| Imprint method | SCIL low pressure softstamp NIL |
| Capacity | 30 – 60 wafers/hour depending on wafers size, wafer material, pattern dimensions and material process |
| Wafer size | 2” up to 200 mm |
| Wafer material | Glass, Silicon, Sapphire, GaAs, other |
| Wafer thickness | 0.3 – 1.7 mm |
| Wafer handling | Cassette-to-cassette, pre-aligning, robot handling |
| Resist types | Thermal sol-gel (NanoGlass T-range) UV sol-gel (NanoGlass UV-range) UV organic |
| Resist coating | Integrated spin coating system |
| Post processing | Baking and cooling |
| Overlay alignment | X,Y alignment accuracy < 3 micron |
FabSCIL
The FabSCIL module can imprint 200 and 300mm wafers and has automatic stamp loading and positioning. It is designed to be docked to a cluster system that takes care of wafer handling, aligning, spin-coating, baking, cooling and other processes.
| Imprint method | SCIL low pressure softstamp NIL |
| Capacity | 20 – 30 wafers/hour depending on wafers size, wafer material, pattern dimensions and material process |
| Wafer size | 200 and 300 mm |
| Wafer material | Glass, Silicon, Sapphire, GaAs, other |
| Wafer thickness | 0.3 – 2.5 mm |
| Wafer handling | Connected to cluster tool / EFEM |
| Resist types | Thermal sol-gel (NanoGlass T-range) UV sol-gel (NanoGlass UV-range) UV organic |
| Overlay alignment | X,Y alignment accuracy < 3 micron |
LabSCIL
The low volume SCIL tool is especially developed for R&D labs at Universities, Research Institutes and companies who are interested to develop SCIL processes and applications. Also for companies interested in a tool that can be used for small series pilot production the low volume SCIL tool will be ideal.
Specifications
| Operation | Manual loading of wafers with a resist coating. Imprint process runs automatically. |
| Wafer size | 2” up to 200 mm |
| Wafer material | Glass, Silicon, Sapphire, GaAs, other |
| Wafer thickness | 0.3 – 1.7 mm |
| Resist types | Thermal sol-gel (NanoGlass T-range) UV sol-gel (NanoGlass UV-range) UV organic |
| Imprinting | SCIL low pressure softstamp NIL |
| Overlay alignment | X,Y alignment accuracy < 3 micron |
Stamp making tools
Consumables
Imprint resists
Stamp materials