Products

Equipment

SCIL Nanoimprint solutions offers NIL manufacturing solutions in a large variety. From manual R&D tools to fully automatic cassette-to-cassette systems and from 2” up to 300 mm wafers.

The manual R&D tools and automatic systems use the same imprint module which allows easy transition from manual to semi-manual and automatic processing.

Key features

  • Tri-layer stamp construction allows conformal contact printing even on nonflat and bowed surfaces.
  • Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles.
  • Overlay alignment < 3 micron
  • The excellent etch properties of the sol-gel resist result in high etch rates.
  • The thermal stability, optical transparancy and (UV) stability of the sol-gel makes it suitable as functional layer.
  • Use of thermal sol-gel increases stamp lifetime.
  • Overall combining highest imprint quality and yield with high throughput and low total cost of ownership.

AutoSCIL

The fully automatic systems include all essential process steps in a closed coupled system: wafer handling, pre-aligning, spin-coating, SCIL imprinting, baking and cooling.

Specifications

Capacity
30 – 60 wafers/hour depending on wafers size, wafer material, pattern dimensions and material process
Wafer size 2” up to 300 mm
Wafer materialGlass, Silicon, Sapphire, GaAs, other
Wafer thickness 0.3 – 1.7 mm
Wafer handling Cassette-to-cassette, pre-aligning, robot handling
Resist types Thermal sol-gel (NanoGlass T-range)
UV sol-gel (NanoGlass UV-range)
UV organic
Resist coating Integrated spin coating system
ImprintingSCIL low pressure softstamp NIL
Post processing Baking and cooling
Overlay alignmentX,Y alignment accuracy < 3 micron

LabSCIL

The low volume SCIL tool is especially developed for R&D labs at Universities, Research Institutes and companies who are interested to develop SCIL processes and applications. Also for companies interested in a tool that can be used for small series pilot production the low volume SCIL tool will be ideal.

Specifications

Operation Manual loading of wafers with a resist coating. Imprint process runs automatically.
Wafer size 2” up to 200 mm
Wafer materialGlass, Silicon, Sapphire, GaAs, other
Wafer thickness0.3 – 1.7 mm
Resist typesThermal sol-gel (NanoGlass T-range)
UV sol-gel (NanoGlass UV-range)
UV organic
ImprintingSCIL low pressure softstamp NIL
Overlay alignmentX,Y alignment accuracy < 3 micron

Stamp making tools

Consumables

Imprint resists

Stamp materials

Dedicated processes